| Printed Electronics - Part 101: Terminology - Vocabulary |
WG 1 |
Christian Punckt |
| Future IEC 62899-2XX-X ED1 : Materials - Measurement for difference in resistance with printing direction of TCE fabricated with wire shaped materials |
WG 2 |
Haekyoung Kim |
| Future IEC 62899-2XX-X ED1 : Materials - Guidelines for printed patterns for mechanical test |
WG 2 |
Byoung-Joon Kim |
| Future IEC 62899-2XX-X ED1 : Materials - Resistance evaluation method for thermoplastic deformation |
WG 2 |
Matti Mäntysalo |
| Future IEC TR 62899-2XX-X: Materials - Measurement and assessment method of dispersibility in silver nano-ink |
WG 2 |
Jinsoo Noh |
| Printed electronics - Part 201-2: Materials - Evaluation method of stretchable substrates |
WG 2 |
Satoshi Maeda |
| Printed electronics - Part 202-4: Materials - Evaluation method of stretchable functional ink (conductive ink and insulator layer) |
WG 2 |
Satoshi Maeda |
| Printed electronics – Part 202-6: Materials – Conductive film – Measurement method for resistance changes under high temperature and humidity of a printed metal based conductive layer on a flexible substrate |
WG 2 |
Haekyoung Kim |
| Printed electronics – Part 202-7 : Materials - Conductive ink – Measurement of peel strength for printed conductive layer on flexible substrate |
WG 2 |
Youngbae Park |
| Printed electronics - Part 204: Materials - Insulator ink |
WG 2 |
Hiroyuki SATO |
| Future IEC 62899-302-4 ED1 : Equipment –Measurement of drop placement |
WG 3 |
Shinri Sakai |
| Printed Electronics – Part 301-3: Equipment – Contact printing – Rigid master – Measurement method of roll master shape errors |
WG 3 |
Dongwoo Kang |
| Printed Electronics – Part 302-3: Equipment – Inkjet – Imaging-based measurement of drop direction |
WG 3 |
Stephen Hoath |
| Printed Electronics – Part 402-3: Printability – Measurement of qualities – Voids of printed patterns using 2D optical image |
WG 4 |
Chung-Hwan Kim |
| Printed Electronics - Part 402-2: Printability - Measurement of qualitities - Edge waviness |
WG 4 |
Yanlin SONG |
| Future IEC TR 62899-5XX: Quality assessment - Framework document on durability testing |
WG 5 |
HYUN JONG KIM |
| Future IEC 62899-50x-1 ED1 : Quality assessment - Printed NFC Antenna and Temperature Sensor |
WG 5 |
Gyoujin Cho |
| Printed electronics-Part503-3:Quality assessment-Measuring method of contact resistance for the printed thin film transistor by transfer length method
|
WG 5 |
Takehito Kozasa |
| IEC 62899-50x-1 ED1: Quality assessment - Mechanical and thermal test of Printed film heater |
WG 5 |
Chae Min Lim |
| IEC 62899-503-2 ED1: Quality assessment - Roll-to-roll printed TFT active matrix: Electrical characterization |
WG 5 |
Gyoujin Cho |
| PrintedElectronics–Part 502-2 : Mechanical and environmental combined stress test methods for flexible OLED elements |
WG 5 |
Kei Hyodo |
| Printed Electronics - Part 503 : Quality Assessment - Test method for the channel properties of the printed thin-film transistor |
WG 5 |
An-Jung Chung |
| Printed electronics - Part 505: Quality assessment - Flexible gas sensor: Mechanical and thermal testing |
WG 5 |
HYUN JONG KIM |
