인쇄전자(IEC/TC 119) 국제표준안
IEC TC119 제정 국제 표준 (2020.01. 기준)
| Reference | Edition | Date | Title |
|---|---|---|---|
| IEC 62899-101:2019 | Edition 1.0 | 2019-10-14 | Printed electronics - Part 101: Terminology - Vocabulary |
| IEC 62899-201:2016 | Edition 1.0 | 2016-02-25 | Printed electronics - Part 201: Materials - Substrates |
| IEC 62899-201:2016/AMD1:2018 | Edition 1.0 | 2018-11-15 | Amendment 1 - Printed electronics - Part 201: Materials - Substrates |
| IEC 62899-201:2016+AMD1:2018 CSV | Edition 1.1 | 2018-11-15 | Printed electronics - Part 201: Materials - Substrates |
| IEC 62899-202:2016 | Edition 1.0 | 2016-02-25 | Printed electronics - Part 202: Materials - Conductive ink |
| IEC 62899-202-3:2019 | Edition 1.0 | 2019-01-16 | Printed electronics - Part 202-3: Materials - Conductive ink - Measurement of sheet resistance of conductive films - Contactless method |
| IEC 62899-202-5:2018 | Edition 1.0 | 2018-09-28 | Printed electronics - Part 202-5: Materials - Conductive ink - Mechanical bending test of a printed conductive layer on an insulating substrate |
| IEC 62899-203:2018 | Edition 1.0 | 2018-09-28 | Printed electronics - Part 203: Materials - Semiconductor ink |
| IEC 62899-204:2019 | Edition 1.0 | 2019-05-20 | Printed electronics - Part 204: Materials - Insulator ink - Measurement methods of properties of insulator inks and printed insulating layers |
| IEC 62899-301-1:2017 | Edition 1.0 | 2017-05-10 | Printed electronics - Part 301-1: Equipment - Contact printing - Rigid master - Measurement method of plate master external dimension |
| IEC 62899-301-2:2017 | Edition 1.0 | 2017-08-30 | Printed electronics - Part 301-2: Equipment - Contact printing - Rigid master - Measurement method of plate master pattern dimension |
| IEC 62899-302-1:2017 | Edition 1.0 | 2017-08-10 | Printed electronics - Part 302-1: Equipment - Inkjet - Imaging based measurement of jetting speed |
| IEC 62899-302-2:2018 | Edition 1.0 | 2018-05-07 | Printed electronics - Part 302-2: Equipment - Inkjet - Imaging-based measurement of droplet volume |
| IEC 62899-303-1:2018 | Edition 1.0 | 2018-05-07 | Printed electronics - Part 303-1: Equipment - Roll-to-roll printing - Mechanical dimensions |
| IEC 62899-401:2017 | Edition 1.0 | 2017-03-03 | Printed electronics - Part 401: Printability - Overview |
| IEC 62899-402-1:2017 | Edition 1.0 | 2017-03-03 | Printed electronics - Part 402-1: Printability - Measurement of qualities - Pattern width |
| IEC 62899-403-1:2018 | Edition 1.0 | 2018-06-21 | Printed electronics - Part 403-1: Printability - Requirements for reproducibility - Basic patterns for evaluation of printing machine |
| IEC 62899-501-1:2019 | Edition 1.0 | 2019-01-16 | Printed electronics - Part 501-1: Quality assessment - Failure modes and mechanical testing - Flexible and/or bendable primary or secondary cells |
| IEC 62899-502-1:2017 | Edition 1.0 | 2017-03-07 | Printed electronics - Part 502-1: Quality assessment - Organic light emitting diode (OLED) elements - Mechanical stress testing of OLED elements formed on flexible substrates |
| IEC 62899-502-2:2019 | Edition 1.0 | 2019-07-24 | Printed electronics - Part 502-2: Quality assessment - Organic light emitting diode (OLED) elements - Combined mechanical and environmental stress test methods for flexible OLED elements |
| IEC TR 62899-250:2016 | Edition 1.0 | 2016-12-14 | Printed electronics - Part 250: Material technologies required in printed electronics for wearable smart devices |
IEC TC119 개발 진행 국제 표준 ( 2020.01. 기준)
| Title | Working Group | Project Leader |
|---|---|---|
| Future IEC 62899-202-8 ED1 : Materials - Measurement for difference in resistance with printing direction of TCE fabricated with wire shaped materials | WG 2 | Haekyoung Kim |
| Future IEC 62899-202-10 ED1 : Materials - Resistance evaluation method for thermoplastic deformation | WG 2 | Outi Rusanen |
| Future IEC TR 62899-2XX-X: Materials - Measurement and assessment method of dispersibility in silver nano-ink | WG 2 | Jinsoo Noh |
| Future IEC 62899-2XX-X: Space charge mobility measurement in organic diodes | WG 2 | Fernando de Castro |
| Printed electronics - Part 201-2: Materials - Evaluation method of stretchable substrates | WG 2 | Satoshi Maeda |
| Printed electronics - Part 202-4: Materials - Conductive ink - Measurement methods for properties of stretchable printed layers(conductive and insulating) | WG 2 | Satoshi Maeda |
| Printed electronics – Part 202-6: Materials – Conductive film – Measurement method for resistance changes under high temperature and humidity of a printed metal based conductive layer on a flexible substrate | WG 2 | Haekyoung Kim |
| Printed electronics – Part 202-7: Printed films – Measurement of peel strength for printed layer on flexible substrate by 90° peel method | WG 2 | Byoung-Joon Kim |
| IEC 62899-202-9 ED1 : Materials - Guidelines for printed patterns for mechanical test | WG 2 | Byoung-Joon Kim |
| Future IEC 62899-302-4 ED1 : Equipment –Imaging based Measurement of drop placement | WG 3 | JNC |
| IEC TR 62899-3XX: Equipment - Inkjet - Overview of Inkjet | WG 3 | Kei Hyodo |
| IEC TR 62899-3XX : Equipment – Substrate - Sheet to sheet mechanical dimension | WG 3 | Yoshiaki Kondoh |
| Printed Electronics – Part 301-3: Equipment – Contact printing – Rigid master – Measurement method of roll master shape errors | WG 3 | Dongwoo Kang |
| Printed Electronics – Part 302-3: Equipment – Inkjet – Imaging-based measurement of drop direction | WG 3 | Stephen Hoath |
| IEC TR 62899-402-4: Printability - Measurements of qualities of printed pattern for vertical variance | WG 4 | Tadahiro Furukawa |
| Printed Electronics - Part 402-2: Printability - Measurement of qualitities - Edge waviness | WG 4 | Yanlin SONG |
| Printed Electronics – Part 402-3: Printability – Measurement of qualities – Voids in printed pattern using two-dimensional optical image | WG 4 | Chung-Hwan Kim |
| Future IEC TR 62899-5XX: Quality assessment - Framework document on durability testing | WG 5 | HYUN JONG KIM |
| Future IEC 62899-505-2 ED1 : Quality assessment - Printed NFC Antenna and Temperature Sensor | WG 5 | Gyu Jin Cho |
| Future IEC 62899-5xx: Printed Electronics - Quality assessment for printed electrode connection to wire | WG 5 | Chae Min Lim |
| Printed Electronics - Part 503-1 : Quality Assessment - Test method for the channel properties of the printed thin-film transistor | WG 5 | An-Jung Chung |
| Printed electronics-Part 503-2: Quality assessment- Test method for Electrical characterization of Roll-to-roll printed TFT active matrix | WG 5 | An-Jung Chung |
| Printed electronics- Part 503-3 : Quality assessment - Measuring method of contact resistance for the printed thin film transistor by transfer length method | WG 5 | Takehito Kozasa |
| Printed electronics - Part 505: Quality assessment - Flexible gas sensor: Mechanical and thermal testing | WG 5 | HYUN JONG KIM |
| Printed electronics-Part 506-1: Quality assessment- Mechanical and thermal tests of printed film heater | WG 5 | Chae Min Lim |