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인쇄전자(IEC/TC 119) 국제표준안

IEC TC119 제정 국제 표준 (2019.02. 기준)

Reference Edition Date Title
IEC 62899-201:2016+AMD1:2018 CSV Edition 1.1 2018-11-15 Printed electronics - Part 201: Materials - Substrates
IEC 62899-201:2016 Edition 1.0 2016-02-25 Printed electronics - Part 201: Materials - Substrates
IEC 62899-201:2016/AMD1:2018 Edition 1.0 2018-11-15 Amendment 1 - Printed electronics - Part 201: Materials - Substrates
IEC 62899-202:2016 Edition 1.0 2016-02-25 Printed electronics - Part 202: Materials - Conductive ink
IEC 62899-202-3:2019 Edition 1.0 2019-01-16 Printed electronics - Part 202-3: Materials - Conductive ink - Measurement of sheet resistance of conductive films - Contactless method
IEC 62899-202-5:2018 Edition 1.0 2018-09-28 Printed electronics - Part 202-5: Materials - Conductive ink - Mechanical bending test of a printed conductive layer on an insulating substrate
IEC 62899-203:2018 Edition 1.0 2018-09-28 Printed electronics - Part 203: Materials - Semiconductor ink
IEC TR 62899-250:2016 Edition 1.0 2016-12-14 Printed electronics-Part250:Material technologies required inprinted electronics for wearable smart devices
IEC 62899-301-1:2017 Edition 1.0 2017-05-10 Printed electronics - Part 301-1: Equipment - Contact printing - Rigid master - Measurement method of plate master external dimension
IEC 62899-301-2:2017 Edition 1.0 2017-08-30 Printed electronics - Part 301-2: Equipment - Contact printing - Rigid master - Measurement method of plate master pattern dimension
IEC 62899-302-1:2017 Edition 1.0 2017-08-10 Printed electronics - Part 302-1: Equipment - Inkjet - Imaging based measurement of jetting speed
IEC 62899-302-2:2018 Edition 1.0 2018-05-07 Printed electronics - Part 302-2: Equipment - Inkjet - Imaging-based measurement of droplet volume
IEC 62899-303-1:2018 Edition 1.0 2018-05-07 Printed electronics - Part 303-1: Equipment - Roll-to-roll printing - Mechanical dimensions
IEC 62899-401:2017 Edition 1.0 2017-03-03 Printed electronics - Part 401: Printability - Overview
IEC 62899-402-1:2017 Edition 1.0 2017-03-03 Printed electronics - Part 402-1: Printability - Measurement of qualities - Pattern width
IEC 62899-403-1:2018 Edition 1.0 2018-06-21 Printed electronics - Part 403-1: Printability - Requirements for reproducibility - Basic patterns for evaluation of printing machine
IEC 62899-501-1:2019 Edition 1.0 2019-01-16 Printed electronics - Part 501-1: Quality assessment - Failure modes and mechanical testing - Flexible and/or bendable primary or secondary cells
IEC 62899-502-1:2017 Edition 1.0 2017-03-07 Printed electronics - Part 502-1: Quality assessment - Organic light emitting diode (OLED) elements - Mechanical stress testing of OLED elements formed on flexible substrates

IEC TC119 개발 진행 국제 표준 ( 2019.02. 기준)

Title WG Project Leader
Printed Electronics - Part 101: Terminology - Vocabulary WG 1 Christian Punckt
Future IEC 62899-2XX-X ED1 : Materials - Measurement for difference in resistance with printing direction of TCE fabricated with wire shaped materials WG 2 Haekyoung Kim
Future IEC 62899-2XX-X ED1 : Materials - Guidelines for printed patterns for mechanical test WG 2 Byoung-Joon Kim
Future IEC 62899-2XX-X ED1 : Materials - Resistance evaluation method for thermoplastic deformation WG 2 Matti Mäntysalo
Future IEC TR 62899-2XX-X: Materials - Measurement and assessment method of dispersibility in silver nano-ink WG 2 Jinsoo Noh
Printed electronics - Part 201-2: Materials - Evaluation method of stretchable substrates WG 2 Satoshi Maeda
Printed electronics - Part 202-4: Materials - Evaluation method of stretchable functional ink (conductive ink and insulator layer) WG 2 Satoshi Maeda
Printed electronics – Part 202-6: Materials – Conductive film – Measurement method for resistance changes under high temperature and humidity of a printed metal based conductive layer on a flexible substrate WG 2 Haekyoung Kim
Printed electronics – Part 202-7 : Materials - Conductive ink – Measurement of peel strength for printed conductive layer on flexible substrate WG 2 Youngbae Park
Printed electronics - Part 204: Materials - Insulator ink WG 2 Hiroyuki SATO
Future IEC 62899-302-4 ED1 : Equipment –Measurement of drop placement WG 3 Shinri Sakai
Printed Electronics – Part 301-3: Equipment – Contact printing – Rigid master – Measurement method of roll master shape errors WG 3 Dongwoo Kang
Printed Electronics – Part 302-3: Equipment – Inkjet – Imaging-based measurement of drop direction WG 3 Stephen Hoath
Printed Electronics – Part 402-3: Printability – Measurement of qualities – Voids of printed patterns using 2D optical image WG 4 Chung-Hwan Kim
Printed Electronics - Part 402-2: Printability - Measurement of qualitities - Edge waviness WG 4 Yanlin SONG
Future IEC TR 62899-5XX: Quality assessment - Framework document on durability testing WG 5 HYUN JONG KIM
Future IEC 62899-50x-1 ED1 : Quality assessment - Printed NFC Antenna and Temperature Sensor WG 5 Gyoujin Cho
Printed electronics-Part503-3:Quality assessment-Measuring method of contact resistance for the printed thin film transistor by transfer length method WG 5 Takehito Kozasa
IEC 62899-50x-1 ED1: Quality assessment - Mechanical and thermal test of Printed film heater WG 5 Chae Min Lim
IEC 62899-503-2 ED1: Quality assessment - Roll-to-roll printed TFT active matrix: Electrical characterization WG 5 Gyoujin Cho
PrintedElectronics–Part 502-2 : Mechanical and environmental combined stress test methods for flexible OLED elements WG 5 Kei Hyodo
Printed Electronics - Part 503 : Quality Assessment - Test method for the channel properties of the printed thin-film transistor WG 5 An-Jung Chung
Printed electronics - Part 505: Quality assessment - Flexible gas sensor: Mechanical and thermal testing WG 5 HYUN JONG KIM
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